Characterization of Thin Films Deposited by Physical Vapor Deposition (PVD), Using Electrochemical Impedance Spectroscopy (EIS) Technique
In this paper the performance against corrosion of a thin film of NiCu deposited by Physical Vapor Deposition at two different times of deposition, was evaluated. Electrochemical Impedance results in NaCl solution, showed a gradual increase in resistivity due to the degradation of the film (delamination) for both times, along with the deposition of corrosion products on the coating generated by recombination of substrate oxides.
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| Main Authors: | , , , , , |
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| Format: | Digital revista |
| Language: | English |
| Published: |
Sociedad Química de México A.C.
2015
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| Online Access: | http://www.scielo.org.mx/scielo.php?script=sci_arttext&pid=S1870-249X2015000400009 |
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