Protective effect of poly(4-Vinylpyridine) containing surface films to the corrosion of copper

We report here on the ability of poly(4-vinylpyridine) (P4VP) films to improve the copper corrosion properties in 0.1 mol L-1 H2SO4. Films formed by Cu(P4VP)2(SCN)2 macromecular-complex were electrochemically or spontaneously (by immersion) grown onto copper surfaces in 3% acetic acid, 0.1 mol L-1 KSCN and P4VP containing solutions. Imaging and electrochemical techniques were employed to characterize the film morphology and evaluate its effect on the copper corrosion, respectively. A substantial increase in corrosion resistance of copper samples spontaneously coated by P4VP films was found in comparison to the uncoated ones. The optimum conditions for spontaneous growth comprise a 3 - 4 h immersion period in a 0.1 mol L-1 P4VP containing solution. Inhibition efficiencies (IE) of 94 - 98% were recorded by employing this methodology. For electrochemically grown P4VP films, the IE was 70 - 85%.

Bibliographic Details

Main Authors:	Giacomelli,Cristiano, Giacomelli,Fernando Carlos, Schmidt,Vanessa, Santana,Adriana Lídia, Pires,Alfredo Tiburcio Nunes, Bertolino,José Roberto, Spinelli,Almir
Format:	Digital revista
Language:	English
Published:	Sociedade Brasileira de Química 2005
Online Access:	http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0103-50532005000100002
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