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Chemical-Mechanical Planarization of Semiconductor Materials [electronic resource] /
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
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| Main Authors: | , |
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| Format: | Texto biblioteca |
| Language: | eng |
| Published: |
Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer,
2004
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| Subjects: | Materials science., Physical chemistry., Industrial engineering., Electronics., Microelectronics., Optical materials., Electronic materials., Materials, Thin films., Materials Science., Characterization and Evaluation of Materials., Electronics and Microelectronics, Instrumentation., Operating Procedures, Materials Treatment., Physical Chemistry., Surfaces and Interfaces, Thin Films., Optical and Electronic Materials., |
| Online Access: | http://dx.doi.org/10.1007/978-3-662-06234-0 |
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