High-Frequency Characterization of Electronic Packaging [electronic resource] /
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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Format: | Texto biblioteca |
Language: | eng |
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Boston, MA : Springer US : Imprint: Springer,
1998
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Subjects: | Engineering., Control engineering., Robotics., Mechatronics., Electrical engineering., Microwaves., Optical engineering., Microwaves, RF and Optical Engineering., Control, Robotics, Mechatronics., Electrical Engineering., |
Online Access: | http://dx.doi.org/10.1007/978-1-4615-5623-7 |
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Engineering. Control engineering. Robotics. Mechatronics. Electrical engineering. Microwaves. Optical engineering. Engineering. Microwaves, RF and Optical Engineering. Control, Robotics, Mechatronics. Electrical Engineering. Engineering. Control engineering. Robotics. Mechatronics. Electrical engineering. Microwaves. Optical engineering. Engineering. Microwaves, RF and Optical Engineering. Control, Robotics, Mechatronics. Electrical Engineering. |
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Engineering. Control engineering. Robotics. Mechatronics. Electrical engineering. Microwaves. Optical engineering. Engineering. Microwaves, RF and Optical Engineering. Control, Robotics, Mechatronics. Electrical Engineering. Engineering. Control engineering. Robotics. Mechatronics. Electrical engineering. Microwaves. Optical engineering. Engineering. Microwaves, RF and Optical Engineering. Control, Robotics, Mechatronics. Electrical Engineering. Martens, Luc. author. SpringerLink (Online service) High-Frequency Characterization of Electronic Packaging [electronic resource] / |
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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples. |
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Engineering. Control engineering. Robotics. Mechatronics. Electrical engineering. Microwaves. Optical engineering. Engineering. Microwaves, RF and Optical Engineering. Control, Robotics, Mechatronics. Electrical Engineering. |
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Martens, Luc. author. SpringerLink (Online service) |
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Martens, Luc. author. SpringerLink (Online service) |
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Martens, Luc. author. |
title |
High-Frequency Characterization of Electronic Packaging [electronic resource] / |
title_short |
High-Frequency Characterization of Electronic Packaging [electronic resource] / |
title_full |
High-Frequency Characterization of Electronic Packaging [electronic resource] / |
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High-Frequency Characterization of Electronic Packaging [electronic resource] / |
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High-Frequency Characterization of Electronic Packaging [electronic resource] / |
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high-frequency characterization of electronic packaging [electronic resource] / |
publisher |
Boston, MA : Springer US : Imprint: Springer, |
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1998 |
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http://dx.doi.org/10.1007/978-1-4615-5623-7 |
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AT martenslucauthor highfrequencycharacterizationofelectronicpackagingelectronicresource AT springerlinkonlineservice highfrequencycharacterizationofelectronicpackagingelectronicresource |
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KOHA-OAI-TEST:1856742018-07-30T23:08:17ZHigh-Frequency Characterization of Electronic Packaging [electronic resource] / Martens, Luc. author. SpringerLink (Online service) textBoston, MA : Springer US : Imprint: Springer,1998.engHigh-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.1: Electronic Packaging and High Frequencies -- 1.1 Packaging and high-frequency effects -- 1.2 Overview of the book chapters -- References -- 2: Electrical Description of Electronic Packaging -- 2.1 Introduction -- 2.2 Circuit descriptions -- 2.3 Qualitative characteristics -- 2.4 Conclusions -- References -- 3: High-Frequency Measurement Techniques -- 3.1 Introduction -- 3.2 Frequency-domain instruments -- 3.3 Time-domain network analyzer -- 3.4 Comparison of frequency- and time-domain network analyzers -- 3.5 Error correction -- 3.6 Conclusion -- References Appendix 3.A: Spatial resolution of the TDR/T-technique -- 4: High-Frequency Measurement Techniques for Electronic Packaging -- 4.1 Introduction -- 4.2 General test fixtures -- 4.3 Dedicated test fixtures with coaxial-planar transitions -- 4.4 On-board probing -- 4.5 Comparison of the coaxial-planar and coplanar probe transitions -- 4.6 De-embedding -- 4.7 Measuring 2N-port structures with two-port instruments -- 4.8 Conclusion -- References -- 5: Measurement-Based Modeling Algorithms -- 5.1 Introduction -- 5.2 One-port components -- 5.3 Transmission lines -- 5.4 General interconnections and packaging -- 5.5 Conclusions -- References.High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.Engineering.Control engineering.Robotics.Mechatronics.Electrical engineering.Microwaves.Optical engineering.Engineering.Microwaves, RF and Optical Engineering.Control, Robotics, Mechatronics.Electrical Engineering.Springer eBookshttp://dx.doi.org/10.1007/978-1-4615-5623-7URN:ISBN:9781461556237 |