High-Frequency Characterization of Electronic Packaging [electronic resource] /

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Bibliographic Details

Main Authors:	Martens, Luc. author., SpringerLink (Online service)
Format:	Texto biblioteca
Language:	eng
Published:	Boston, MA : Springer US : Imprint: Springer, 1998
Subjects:	Engineering., Control engineering., Robotics., Mechatronics., Electrical engineering., Microwaves., Optical engineering., Microwaves, RF and Optical Engineering., Control, Robotics, Mechatronics., Electrical Engineering.,
Online Access:	http://dx.doi.org/10.1007/978-1-4615-5623-7
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