Advanced Wirebond Interconnection Technology [electronic resource] /

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Bibliographic Details

Main Authors:	Prasad, Shankara K. author., SpringerLink (Online service)
Format:	Texto biblioteca
Language:	eng
Published:	Boston, MA : Springer US, 2004
Subjects:	Engineering., Manufacturing industries., Machines., Tools., Electronics., Microelectronics., Electronic circuits., Optical materials., Electronic materials., Manufacturing, Machines, Tools., Electronics and Microelectronics, Instrumentation., Circuits and Systems., Optical and Electronic Materials.,
Online Access:	http://dx.doi.org/10.1007/b105273
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