Low Dielectric Constant Materials for IC Applications [electronic resource] /

Low Dielectric Constant Materials for IC Applications [electronic resource] /

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Bibliographic Details
Main Authors: Ho, Paul S. editor., Leu, Jihperng Jim. editor., Lee, Wei William. editor., SpringerLink (Online service)
Format: Texto biblioteca
Language:eng
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2003
Subjects:Engineering., Electronics., Microelectronics., Optical materials., Electronic materials., Materials science., Electronics and Microelectronics, Instrumentation., Optical and Electronic Materials., Characterization and Evaluation of Materials.,
Online Access:http://dx.doi.org/10.1007/978-3-642-55908-2
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record_format koha
institution COLPOS
collection Koha
country México
countrycode MX
component Bibliográfico
access En linea
En linea
databasecode cat-colpos
tag biblioteca
region America del Norte
libraryname Departamento de documentación y biblioteca de COLPOS
language eng
topic Engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials science.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
Engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials science.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
spellingShingle Engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials science.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
Engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials science.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
Ho, Paul S. editor.
Leu, Jihperng Jim. editor.
Lee, Wei William. editor.
SpringerLink (Online service)
Low Dielectric Constant Materials for IC Applications [electronic resource] /
description Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
format Texto
topic_facet Engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials science.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
author Ho, Paul S. editor.
Leu, Jihperng Jim. editor.
Lee, Wei William. editor.
SpringerLink (Online service)
author_facet Ho, Paul S. editor.
Leu, Jihperng Jim. editor.
Lee, Wei William. editor.
SpringerLink (Online service)
author_sort Ho, Paul S. editor.
title Low Dielectric Constant Materials for IC Applications [electronic resource] /
title_short Low Dielectric Constant Materials for IC Applications [electronic resource] /
title_full Low Dielectric Constant Materials for IC Applications [electronic resource] /
title_fullStr Low Dielectric Constant Materials for IC Applications [electronic resource] /
title_full_unstemmed Low Dielectric Constant Materials for IC Applications [electronic resource] /
title_sort low dielectric constant materials for ic applications [electronic resource] /
publisher Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer,
publishDate 2003
url http://dx.doi.org/10.1007/978-3-642-55908-2
work_keys_str_mv AT hopaulseditor lowdielectricconstantmaterialsforicapplicationselectronicresource
AT leujihperngjimeditor lowdielectricconstantmaterialsforicapplicationselectronicresource
AT leeweiwilliameditor lowdielectricconstantmaterialsforicapplicationselectronicresource
AT springerlinkonlineservice lowdielectricconstantmaterialsforicapplicationselectronicresource
_version_ 1756264073091088384
spelling KOHA-OAI-TEST:1759672018-07-30T22:54:22ZLow Dielectric Constant Materials for IC Applications [electronic resource] / Ho, Paul S. editor. Leu, Jihperng Jim. editor. Lee, Wei William. editor. SpringerLink (Online service) textBerlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer,2003.engLow dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.1 Overview on Low Dielectric Constant Materials for IC Applications -- 1.1 Introduction -- 1.2 Dielectric Constant and Bonding Characteristics -- 1.3 Material Properties and Integration Requirements -- 1.4 Characterization of Low-? Dielectrics -- 1.5 Porous Low-? Materials -- 1.6 Conclusion -- References -- 2 Materials Issues and Characterization of Low-? Dielectric Materials -- 2.1 Introduction -- 2.2 Thin-Film Material Characterization -- 2.3 General Structure-Property Relationships -- 2.4 Fluorinated Polyimide: Effect of Chemical-Structure Modifications on Film Properties -- 2.5 Crosslinked and Thermosetting Materials -- 2.6 Parylene Polymers: Effect of Thermal History on Film Properties -- 2.7 Future Challenges -- References -- 3 Structure and Property Characterization of Low-? Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering -- 3.1 Introduction -- 3.2 Two-Phase Methodology -- 3.3 Three-Phase Methodology -- 3.4 Films with Ordered Porous Structure -- 3.5 Limits of SANS Characterization Methods -- 3.6 Future Developments -- 3.7 Conclusion -- References -- 4 Vapor Deposition of Low-? Polymeric Dielectrics -- 4.1 Introduction -- 4.2 Vapor-Phase Deposition and Polymerization on Substrates -- 4.3 Parylenes -- 4.4 Polynaphthalene and Its Derivatives -- 4.5 Teflon and Its Derivatives -- 4.6 Vapor-Deposited Polyimides -- 4.7 Prospects for Vapor-Depositable Low-? Polymers -- References -- 5 Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-? Materials -- 5.1 Introduction -- 5.2 FSG Films -- 5.3 a-C:F Films -- References -- 6 Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity -- 6.1 Introduction -- 6.2 Porous Silica -- 6.3 Organosilicates -- 6.4 Porogens -- 6.5 Porous Organosilicate Matrix Resins -- 6.6 Formation of Nanohybrids -- 6.7 Porous Organosilicates -- 6.8 Characterization of Porous Organosilicates -- 6.9 Conclusion -- References -- 7 Metal/Polymer Interfacial Interactions -- 7.1 Introduction -- 7.2 Experimental Methods -- 7.3 Metallization of Fluoropolymers -- 7.4 Polymers on Metals: Adhesion to Cu -- 7.5 Conclusion -- References -- 8 Diffusion of Metals in Polymers and During Metal/Polymer Interface Formation -- 8.1 Introduction -- 8.2 Thermodynamic Considerations -- 8.3 Effect of Metal-Polymer Interaction on the Mobility of Metal Atoms -- 8.4 Surface Diffusion, Nucleation, and Growth of Metal Films -- 8.5 Diffusion and Aggregation -- 8.6 Atomic Diffusion -- 8.7 Conclusion -- References -- 9 Plasma Etching of Low Dielectric Constant Materials -- 9.1 Introduction -- 9.2 Technological Requirements and Patterning Approaches -- 9.3 Fluorocarbon-Based Etching Processes -- 9.4 Directional Etching of Organic Low-? Materials -- 9.5 Postetch Mask-Stripping and Via-Cleaning Processes -- 9.6 Conclusion -- References -- 10 Integration of SiLK Semiconductor Dielectric -- 10.1 Introduction -- 10.2 SiLK Semiconductor Dielectric -- 10.3 Subtractive Technologies -- 10.4 Damascene Technologies -- 10.5 Cost-of-Ownership -- 10.6 Conclusion -- References.Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.Engineering.Electronics.Microelectronics.Optical materials.Electronic materials.Materials science.Engineering.Electronics and Microelectronics, Instrumentation.Optical and Electronic Materials.Characterization and Evaluation of Materials.Springer eBookshttp://dx.doi.org/10.1007/978-3-642-55908-2URN:ISBN:9783642559082

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