Low Dielectric Constant Materials for IC Applications [electronic resource] /

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Bibliographic Details

Main Authors:	Ho, Paul S. editor., Leu, Jihperng Jim. editor., Lee, Wei William. editor., SpringerLink (Online service)
Format:	Texto biblioteca
Language:	eng
Published:	Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2003
Subjects:	Engineering., Electronics., Microelectronics., Optical materials., Electronic materials., Materials science., Electronics and Microelectronics, Instrumentation., Optical and Electronic Materials., Characterization and Evaluation of Materials.,
Online Access:	http://dx.doi.org/10.1007/978-3-642-55908-2
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