Fundamentals of Adhesion [electronic resource] /

Fundamentals of Adhesion [electronic resource] /

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The Chemistry and Physics of Solid Adhesion -- Thermodynamics of Adhesion -- Theory of Adhesive Forces Across Interfaces -- Theory of Adhesive Forces Across Interfaces -- The Dynamics of Wetting -- Kinetics of Polymer—Polymer Interdiffusion -- Welding, Tack, and Green Strength of Polymers -- Role of Electrostatics in Adhesion -- Adhesion Through Silane Coupling Agents -- Adhesive—Adherend Interface and Interphase -- Adhesion at Metal Interfaces -- Hard—Soft Acid—Base (HSAB) Principle for Solid Adhesion and Surface Interactions -- Interface Design for Thin Film Adhesion -- Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces -- Aspects of Bioadhesion.

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Bibliographic Details
Main Authors: Lee, Lieng-Huang. editor., SpringerLink (Online service)
Format: Texto biblioteca
Language:eng
Published: Boston, MA : Springer US : Imprint: Springer, 1991
Subjects:Chemistry., Inorganic chemistry., Organic chemistry., Polymers., Solid state physics., Spectroscopy., Microscopy., Materials science., Inorganic Chemistry., Organic Chemistry., Polymer Sciences., Characterization and Evaluation of Materials., Solid State Physics., Spectroscopy and Microscopy.,
Online Access:http://dx.doi.org/10.1007/978-1-4899-2073-7
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id KOHA-OAI-TEST:203186
record_format koha
spelling KOHA-OAI-TEST:2031862018-07-30T23:31:27ZFundamentals of Adhesion [electronic resource] / Lee, Lieng-Huang. editor. SpringerLink (Online service) textBoston, MA : Springer US : Imprint: Springer,1991.engThe Chemistry and Physics of Solid Adhesion -- Thermodynamics of Adhesion -- Theory of Adhesive Forces Across Interfaces -- Theory of Adhesive Forces Across Interfaces -- The Dynamics of Wetting -- Kinetics of Polymer—Polymer Interdiffusion -- Welding, Tack, and Green Strength of Polymers -- Role of Electrostatics in Adhesion -- Adhesion Through Silane Coupling Agents -- Adhesive—Adherend Interface and Interphase -- Adhesion at Metal Interfaces -- Hard—Soft Acid—Base (HSAB) Principle for Solid Adhesion and Surface Interactions -- Interface Design for Thin Film Adhesion -- Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces -- Aspects of Bioadhesion.Chemistry.Inorganic chemistry.Organic chemistry.Polymers.Solid state physics.Spectroscopy.Microscopy.Materials science.Chemistry.Inorganic Chemistry.Organic Chemistry.Polymer Sciences.Characterization and Evaluation of Materials.Solid State Physics.Spectroscopy and Microscopy.Springer eBookshttp://dx.doi.org/10.1007/978-1-4899-2073-7URN:ISBN:9781489920737
institution COLPOS
collection Koha
country México
countrycode MX
component Bibliográfico
access En linea
En linea
databasecode cat-colpos
tag biblioteca
region America del Norte
libraryname Departamento de documentación y biblioteca de COLPOS
language eng
topic Chemistry.
Inorganic chemistry.
Organic chemistry.
Polymers.
Solid state physics.
Spectroscopy.
Microscopy.
Materials science.
Chemistry.
Inorganic Chemistry.
Organic Chemistry.
Polymer Sciences.
Characterization and Evaluation of Materials.
Solid State Physics.
Spectroscopy and Microscopy.
Chemistry.
Inorganic chemistry.
Organic chemistry.
Polymers.
Solid state physics.
Spectroscopy.
Microscopy.
Materials science.
Chemistry.
Inorganic Chemistry.
Organic Chemistry.
Polymer Sciences.
Characterization and Evaluation of Materials.
Solid State Physics.
Spectroscopy and Microscopy.
spellingShingle Chemistry.
Inorganic chemistry.
Organic chemistry.
Polymers.
Solid state physics.
Spectroscopy.
Microscopy.
Materials science.
Chemistry.
Inorganic Chemistry.
Organic Chemistry.
Polymer Sciences.
Characterization and Evaluation of Materials.
Solid State Physics.
Spectroscopy and Microscopy.
Chemistry.
Inorganic chemistry.
Organic chemistry.
Polymers.
Solid state physics.
Spectroscopy.
Microscopy.
Materials science.
Chemistry.
Inorganic Chemistry.
Organic Chemistry.
Polymer Sciences.
Characterization and Evaluation of Materials.
Solid State Physics.
Spectroscopy and Microscopy.
Lee, Lieng-Huang. editor.
SpringerLink (Online service)
Fundamentals of Adhesion [electronic resource] /
description The Chemistry and Physics of Solid Adhesion -- Thermodynamics of Adhesion -- Theory of Adhesive Forces Across Interfaces -- Theory of Adhesive Forces Across Interfaces -- The Dynamics of Wetting -- Kinetics of Polymer—Polymer Interdiffusion -- Welding, Tack, and Green Strength of Polymers -- Role of Electrostatics in Adhesion -- Adhesion Through Silane Coupling Agents -- Adhesive—Adherend Interface and Interphase -- Adhesion at Metal Interfaces -- Hard—Soft Acid—Base (HSAB) Principle for Solid Adhesion and Surface Interactions -- Interface Design for Thin Film Adhesion -- Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces -- Aspects of Bioadhesion.
format Texto
topic_facet Chemistry.
Inorganic chemistry.
Organic chemistry.
Polymers.
Solid state physics.
Spectroscopy.
Microscopy.
Materials science.
Chemistry.
Inorganic Chemistry.
Organic Chemistry.
Polymer Sciences.
Characterization and Evaluation of Materials.
Solid State Physics.
Spectroscopy and Microscopy.
author Lee, Lieng-Huang. editor.
SpringerLink (Online service)
author_facet Lee, Lieng-Huang. editor.
SpringerLink (Online service)
author_sort Lee, Lieng-Huang. editor.
title Fundamentals of Adhesion [electronic resource] /
title_short Fundamentals of Adhesion [electronic resource] /
title_full Fundamentals of Adhesion [electronic resource] /
title_fullStr Fundamentals of Adhesion [electronic resource] /
title_full_unstemmed Fundamentals of Adhesion [electronic resource] /
title_sort fundamentals of adhesion [electronic resource] /
publisher Boston, MA : Springer US : Imprint: Springer,
publishDate 1991
url http://dx.doi.org/10.1007/978-1-4899-2073-7
work_keys_str_mv AT leelienghuangeditor fundamentalsofadhesionelectronicresource
AT springerlinkonlineservice fundamentalsofadhesionelectronicresource
_version_ 1756267803263893504

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