Computer Vision for Electronics Manufacturing [electronic resource] /

DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep­ tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure­ ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en­ gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac­ tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina­ tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.

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Bibliographic Details
Main Authors: Pau, L. F. author., SpringerLink (Online service)
Format: Texto biblioteca
Language:eng
Published: Boston, MA : Springer US, 1990
Subjects:Computer science., Electrical engineering., Computer Science., Computer Science, general., Electrical Engineering.,
Online Access:http://dx.doi.org/10.1007/978-1-4613-0507-1
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id KOHA-OAI-TEST:184085
record_format koha
institution COLPOS
collection Koha
country México
countrycode MX
component Bibliográfico
access En linea
En linea
databasecode cat-colpos
tag biblioteca
region America del Norte
libraryname Departamento de documentación y biblioteca de COLPOS
language eng
topic Computer science.
Electrical engineering.
Computer Science.
Computer Science, general.
Electrical Engineering.
Computer science.
Electrical engineering.
Computer Science.
Computer Science, general.
Electrical Engineering.
spellingShingle Computer science.
Electrical engineering.
Computer Science.
Computer Science, general.
Electrical Engineering.
Computer science.
Electrical engineering.
Computer Science.
Computer Science, general.
Electrical Engineering.
Pau, L. F. author.
SpringerLink (Online service)
Computer Vision for Electronics Manufacturing [electronic resource] /
description DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep­ tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure­ ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en­ gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac­ tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina­ tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.
format Texto
topic_facet Computer science.
Electrical engineering.
Computer Science.
Computer Science, general.
Electrical Engineering.
author Pau, L. F. author.
SpringerLink (Online service)
author_facet Pau, L. F. author.
SpringerLink (Online service)
author_sort Pau, L. F. author.
title Computer Vision for Electronics Manufacturing [electronic resource] /
title_short Computer Vision for Electronics Manufacturing [electronic resource] /
title_full Computer Vision for Electronics Manufacturing [electronic resource] /
title_fullStr Computer Vision for Electronics Manufacturing [electronic resource] /
title_full_unstemmed Computer Vision for Electronics Manufacturing [electronic resource] /
title_sort computer vision for electronics manufacturing [electronic resource] /
publisher Boston, MA : Springer US,
publishDate 1990
url http://dx.doi.org/10.1007/978-1-4613-0507-1
work_keys_str_mv AT paulfauthor computervisionforelectronicsmanufacturingelectronicresource
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spelling KOHA-OAI-TEST:1840852018-07-30T23:05:25ZComputer Vision for Electronics Manufacturing [electronic resource] / Pau, L. F. author. SpringerLink (Online service) textBoston, MA : Springer US,1990.engDEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep­ tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure­ ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en­ gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac­ tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina­ tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.and Organization of the Book -- I. Applications and Systems Aspects -- 1. Vision System Components -- 2. Imaging Microscopes for Microelectronics -- 3. Metrology in Electronic Devices and Substrates -- 4. Inspection of Integrated Circuits and Gate Arrays -- 5. Sensor Fusion for Integrated Circuit Testing -- 6. Wafer Inspection -- 7. Mask Repair and Inspection -- 8. Knowledge-Based Processing -- 9. Design Rule Verification -- 10. Printed Circuit Board (PCB) Inspection -- 11. Inspection for Assembly Tasks -- 12. Knowledge-Based Printed Circuit Board Manufacturing -- II. Vision Algorithms for Electronics Manufacturing -- 13. Image Quantization and Thresholding -- 14. Geometrical Corrections -- 15. Image Registration and Subtraction -- 16. Edge and Line Detection -- 17. Region Segmentation and Boundaries -- 18. Geometry of Connected Components and Morphomathematics -- 19. Feature Extraction -- 20. Decision Logic -- 21. Image Data Structures and Management -- 22. Conclusion: The Future of Computer Vision for Electronics Manufacturing -- Appendixes -- A. Glossary and Abbreviations -- B. Relevant Journals -- C. Units and Conversion Tables -- References -- Suggested Readings.DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep­ tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure­ ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en­ gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac­ tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina­ tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.Computer science.Electrical engineering.Computer Science.Computer Science, general.Electrical Engineering.Springer eBookshttp://dx.doi.org/10.1007/978-1-4613-0507-1URN:ISBN:9781461305071